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- SAMSUNG M393A4K40DB3 32GB DDR4 RDIMM Server Memory (RAM), 3200 Mbps Memory Speed, 2R x 4 Rank, ECC, 1.2 Voltage, 288 Pins | M393A4K40DB3-CWE SAMSUNG M393A4K40DB3 32GB DDR4 RDIMM Server Memory (RAM), 3200 Mbps Memory Speed, 2R x 4 Rank, ECC, 1.2 Voltage, 288 Pins | M393A4K40DB3-CWE


SAMSUNG M393A4K40DB3 32GB DDR4 RDIMM Server Memory (RAM), 3200 Mbps Memory Speed, 2R x 4 Rank, ECC, 1.2 Voltage, 288 Pins | M393A4K40DB3-CWE
- 32 GB capacity in a single 288‑pin RDIMM
- DDR4‑3200 MT/s high-speed performance (PC4‑25600 data rate)
- ECC Registered: enhances reliability and signal stability
- Dual‑rank layout (2R×4) for improved density and error correction
- 1.2 V low‑voltage power efficiency
- Ideal for servers, virtualization, AI/5G workloads
- Professionally tested; known CAS latency ~22 (CL22)
- Description
- Specification
Samsung 32 GB DDR4‑3200 MHz ECC RDIMM – Ultimate Server Performance
The Samsung M393A4K40DB3‑CWE is a high-performance, ECC-registered memory module engineered for servers, data centers, and mission-critical applications. This 32 GB DDR4 RDIMM operates at blazing-fast 3200 MT/s (PC4-25600) speeds with low power consumption at just 1.2 V. Dual-rank (2R×4) configuration provides excellent data integrity and stability, while ECC (Error‑Correcting Code) ensures continuous uptime by detecting and correcting memory errors on the fly.
Designed for 288-pin DIMM motherboards supporting registered ECC memory, this module integrates logic-level buffering (“registered”) to optimize signal integrity across multi-slot server environments. Ideal for virtualization, database servers, and enterprise workloads, the M393A4K40DB3 delivers robust performance and compatibility backed by Samsung engineering.
Feature | Specification |
---|---|
Capacity | 32 GB |
Memory Type | DDR4 SDRAM |
DIMM Type | Registered (RDIMM) |
Error Correction | ECC (Error‑Correcting Code) |
Speed | 3200 MT/s (PC4‑25600) |
Voltage | 1.2 V |
Rank × Organization | 2R × 4 |
CAS Latency | CL22 (tRCD/tRP/tRAS typical) |
Pins | 288-pin |
Component Composition | (2 Gbit × 4) × 36 |
Application | Server, Data Center, AI, 5G |
Form Factor | 1 DIMM module, 133 mm × 30 mm |
Industry Status | Discontinued / EOL |